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Maxim > Products > High-Frequency ASICs Fiber

Packaging

IC Packages for High-Frequency Applications

HF applications drive improvements in electrical, thermal and mechanical performance for IC package technologies. While all standard Maxim packages are available for ASIC designs, several package families are of course optimum for RF and Fiber ASICs. These types are the exposed paddle variants of the TSSOP and TQFP packages, the QFN family, and the UCSP style of bumped chips.

Exposed-pad packages address the electrical performance (generally reducing lead inductance and inductance to ground) and thermal performance simultaneously by offering a thermal path out of the package through the exposed die pad. Exposed pads are available in dual type (TSSOP) and quad type (TQFP) packages. Taking the reduction of lead inductance a step farther are the Quad Flatpack Nonleaded (QFN) packages with leads embedded within the package body while maintaining the exposed pad.

Ball Grid technologies offer transmission line characteristics in Enhanced Super-BGA (SBGA) with the most practical miniaturization in package size achieved by the ultra chip scale packages (UCSP) such as bumped chips.

With this portfolio of package offerings, Maxim can provide packaging solutions for the most demanding of RF applications.

Type Leads Description Doc Ctl Revision
µMAX-EP 8 Micro-MAX, Exposed Pad 21-0107 A
µMAX-EP 10 Micro-MAX, Exposed Pad 21-0109 B
µMAX/µSOP 8 Micro-MAX/Micro-SOP 21-0036 J
µMAX/µSOP 10 Micro-MAX/Micro-SOP 21-0061 I
CDIP.300 8,14,16,18,20,24 Ceramic DIP .300" 21-0045 A
CDIP.300 8 Ceramic DIP .300" 21-0326 E
CDIP.300 14 Ceramic DIP .300"21-0332 D
CDIP.300 20 Ceramic DIP .300" 21-0335 D
CDIP.300 24 Ceramic DIP .300" 21-0340 D
CDIP.300 16 Ceramic DIP .300" 21-0590 D
CDIP.300 18 Ceramic DIP .300" 21-0594 D
CDIP.600 24,28,40 Ceramic DIP .600" 21-0046 A
CDIP.600 24 Ceramic DIP .600" 21-0339 C
CDIP.600 28 Ceramic DIP .600" 21-0344 D
CDIP.600 40 Ceramic DIP .600" 21-0349 D
CSBGA 100 CSBGA, 9x9x1.4 mm 21-0153 B
CSBGA 144 CSBGA, 12x12x1.4mm, 0.8mm pitch 21-0163 A
DDPAK 3 DDPAK 21-0131 A
DDPAK 5 DDPAK 21-0132 A
DDPAK 7 DDPAK21-0133 A
FPCK 14 Flatpack 21-0012 A
FPCK 10 Flatpack 21-0014 A
FPCK 84 Flatpack 21-0138 A
FPCK 16 Flatpack, MIL 1835 (F16-2) 21-0828 B
FPCK 10 Flatpack, MIL1835 21-0010 D
FPCK 14 Flatpack, MIL1835 21-0011 A
FPCK 16 Flatpack, MIL1835 (F16-2) 21-0013 A
FPCK 84 Flatpack, with Heatsink 21-7002 A
LCC 44 LCC 21-0062 B
LCC 20 LCC 21-0658 B
LCC 28 LCC 21-4497 A
LCC 18 LCC 21-7001 A
LGA 48 LGA 7x7x1.4 MM (WC32Z) 21-0157 A
LGA 48 LGA, 7x7x1.4mm21-0152 A
MQFP 160 ED-QUAD, 28x28x3.5mm w/EXPOSED HEAT SPREADER, INVERTED DIE PAD 21-0150 A
MQFP 100 MQFP 21-7003 A
MQFP 52,64,80 MQFP 14x14mm 21-7005 A
MQFP 44 MQFP, 1.60 LEAD FORM 21-0826 D
PDIP.300 8,14,16,18,20,24,28 PDIP .300" 21-0043 D
PDIP.300 28 Plastic DIP .300" 21-0400 B
PDIP.600 24,28,40 Plastic DIP .600" 21-0044 B
PDIP.600 48 Plastic DIP .600" 21-0124 A
PLCC 20,28,44,52,68 PLCC 21-0049 D
QFN 68 QFN 10x10x0.9mm21-0122 C
QFN 68 QFN 10x10x0.9mm (custom) 21-0103 C
QFN 68 QFN 10x10x0.9mm, (G6800-3) 21-0130 A
QFN 12,16 QFN 3x3x0.9mm 21-0102 G
QFN 12,16,20,24 QFN 4x4x0.9mm 21-0106 E
QFN 16,20,28,32 QFN 5x5x0.9mm 21-0091 I
QFN 36,40 QFN 6x6x0.9mm 21-0105 F
QFN 32,44,48 QFN 7x7x0.9mm 21-0092 H
QFN 56,56 QFN 8x8x0.9 mm21-0129 B
QFN-Thin 68 THIN QFN 10x10x0.8 mm 21-0142 C
QFN-Thin 12,16 THIN QFN 3x3x0.8mm 21-0136 E
QFN-Thin 12,16,20,24 THIN QFN 4x4x0.8mm 21-0139 C
QFN-Thin 16,20,28,32,40 THIN QFN 5x5x0.8mm 21-0140 E
QFN-Thin 40 THIN QFN 5x5x0.8mm, 0.4mm Lead Pitch 21-0159 A
QFN-Thin 36,40,48 THIN QFN 6x6x0.8mm 21-0141 E
QFN-Thin 48 THIN QFN 6x6x0.8mm, 0.4mm Lead Pitch 21-0160 A
QFN-Thin 32,44,48,56 THIN QFN 7x7x0.8mm 21-0144 D
QFN-Thin 56 THIN QFN 7x7x0.8mm, 0.4mm Lead Pitch 21-0161 A
QFN-Thin 48 THIN QFN 8x6x0.8mm 21-0149 B
QFN-Thin 56 THIN QFN 8x8x0.8mm 21-0135 D
QSOP 16,20,24,28 QSOP .150" 21-0055 E
QSOP-EP 16 QSOP .150" EXPOSED PAD 21-0112 C
SB.300 8,14,16,18,20,24 Side-Braze DIP .300" 21-0047 A
SB.600 24,28,40 Side-Braze DIP .600" 21-0048 A
SBGA 88 SBGA 17x17mm, 1.27mm PITCH 21-0126 A
SBGA 80 SBGA 13x13mm, 1.0mm PITCH 21-0125 A
SBGA 192,256 SBGA, 25x25mm, 27x27mm 21-0073 D
SC70 3 SC70 21-0075 B
SC70 5 SC70 21-0076 B
SC70 6 SC70 21-0077 B
SC70 4 SC70 21-0098 B
SOIC 16,28 SOIC (RT47) 21-0145 A
SOIC.150 8,14,16 SOIC .150" 21-0041 B
SOIC.150-EP 8 SOIC .150", EXPOSED PAD 21-0111 B
SOIC.300 16,18,20,24,28 SOIC .300" 21-0042 B
SOT143 4 SOT-143 21-0052 E
SOT23 5 5 Lead SOT-23 21-0057 E
SOT23 3 SOT-23 21-0051 F
SOT23 6 SOT-23 21-0058 F
SOT23 8 SOT-23 21-0078 D
SSOP 36 SSOP 21-0040 E
SSOP 14,16,20,24,28 SSOP, 5.3x.6mm 21-0056 C
TDFN-EP 6,8,10,14 TDFN, EXPOSED PAD, 3x3x0.8mm 21-0137 E
THIN SOT23 8 THIN SOT (LOW PROFILE) 21-0154 A
THIN SOT23 5 THIN SOT23 21-0113 B
THIN SOT23 6 THIN SOT23 21-0114 B
TO-100 10 TO-100 21-0023 A
TO-220 7 TO-220 21-0064 B
TO-3 8 TO-3 21-0029 A
TO-3 4 TO-3 21-0031 B
TO-39 3 TO-39 21-0021 A
TO-52 3 TO-52 21-0019 A
TO-52 2 TO-52 21-0020 A
TO-8 12 TO-8 21-0030 A
TO-99 8 TO-99 21-0022 A
TQFP 52 TQFP 10x10x1.0mm 21-0146 A
TQFP 64 TQFP 10x10x1.4mm 21-0083 A
TQFP 80 TQFP 12x12x1.0mm 21-0072 A
TQFP 100 TQFP 14x14x1.0mm 21-0085 A
TQFP 128 TQFP 14x20x1.4mm 21-0086 A
TQFP 144 TQFP 20x20x1.0mm 21-0087 A
TQFP 32 TQFP 5x5x1.0mm 21-0110 A
TQFP 32,48 TQFP 7x7x1.4mm 21-0054 D
TQFP-EP 64 TQFP 10x10x1.00mm, Exposed Pad Option, Inverted Pad 21-0162 A
TQFP-EP 64 TQFP 10x10x1.0mm, Exposed Pad 21-0084 B
TQFP-EP 80 TQFP 12x12x1.0mm, Exposed Pad 21-0115 B
TQFP-EP 100 TQFP 14x14x1.0mm, Exposed Pad 21-0116 B
TQFP-EP 32 TQFP 5x5x1.0mm, Exposed Pad 21-0079 E
TQFP-EP 32,48 TQFP 7x7x1.0mm, Exposed Pad 21-0065 E
TQFP-EP-IDP 100 TQFP, 14x14x1.0mm, Exposed pad, Inverted die pad 21-0148 A
TSSOP 14,16,20,24,28 TSSOP 4.40mm 21-0066 F
TSSOP 38 TSSOP 4.40mm, 0.5mm Pitch 21-0081 C
TSSOP 48 TSSOP, 6.1mm 21-0155 B
TSSOP-EP 14,16,20,28 TSSOP 4.40mm, Exposed Pad 21-0108 D
UCSP 4 UCSP 2x2 21-0117 G
UCSP 6 UCSP 3x2 21-0097 G
UCSP 9 UCSP 3x3 21-0093 I
UCSP 8 UCSP 4x2 21-0156 A
UCSP 12 UCSP 4x3 21-0104 F
UCSP 16 UCSP 4x4 21-0101 H
UCSP 20 UCSP 5x4 21-0095 I
UCSP 20 UCSP 5x4 (WC11Z) 21-0127 D
UCSP 25 UCSP 5x5 21-0096 H
UCSP 30 UCSP 6x5 21-0123 G
UCSP 36 UCSP 6x6 21-0082 J
uDFN 6 uDFN, 1.5x1.0x0.8 MM21-0147 B

*In qualification now. New pin count and body styles are constantly being added.
Contact factory for details.
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